• DocumentCode
    3521601
  • Title

    Dynamic visualizations of flow and meniscus for quadrilateral bump arrangement in capillary underfill process

  • Author

    Lee, Seok Hwan ; Sung, Jaeyong

  • Author_Institution
    Grad. Sch. of Nano Inf. Design Fusion Technol., Seoul Nat. Univ. of Technol., Seoul, South Korea
  • fYear
    2009
  • fDate
    9-11 Dec. 2009
  • Firstpage
    215
  • Lastpage
    219
  • Abstract
    This study has investigated the dynamic variations of flow and meniscus during underfill process using flow visualization technique to understand physics of underfill flows. As a quantitative flow visualization technique, ¿-PIV(micro particle image velocimetry) was applied. Glycerin was filled into a glass chip which has quadrilateral bump arrangement. It was found that the wetting distance increases rapidly when the meniscus attaches onto the bump and it increases slowly when the meniscus detaches from the bump. The contact angle and the meniscus velocity are in-phase according to the meniscus position. The flow velocity is the fastest between bumps when the meniscus is detached and then the flow velocity continuously gets slow down.
  • Keywords
    contact angle; flip-chip devices; flow visualisation; wetting; capillary underfill process; contact angle; dynamic flow visualizations; dynamic variations; flip chip technology; flow velocity; glass chip; glycerin; meniscus position; meniscus velocity; microparticle image velocimetry; quadrilateral bump arrangement; quantitative flow visualization technique; underfill flows; wetting distance; ¿-PIV; Filling; Flip chip; Fluorescence; Glass; Mechanical engineering; Microscopy; Particle measurements; Semiconductor device measurement; Velocity measurement; Visualization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2009. EPTC '09. 11th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-5099-2
  • Electronic_ISBN
    978-1-4244-5100-5
  • Type

    conf

  • DOI
    10.1109/EPTC.2009.5416549
  • Filename
    5416549