Numerical study on thermal management of LED packaging by using thermoelectric cooling

The heat generated from LED (Light-emitting Diode) keeps rising with the rapid development of LED luminous flux and brightness in recent years. So it´s urgent to find effective heat dissipation ways for thermal management of LED packaging. The finite element model of LED packaging heat dissipation, based on the thermal resistance model of flip-chip LED packaging and the principle of thermoelectric refrigeration, was founded by ANSYS in this paper. Performance parameters such as LED junction temperature (T₀), substrate temperature (T_sub), hot end and cold end temperature of Thermoelectric Cooler (TEC) (T_h, T_c), heat sink temperature (T_sink) and coefficient of performance (COP) were investigated systematically in the situation of different chip power and different TEC input current. The optimized parameters of packaging heat dissipation in different conditions were analyzed through comparing simulation results of the thermoelectric cooling method and the natural convection cooling method with and without heat sink.