• DocumentCode
    3521682
  • Title

    Failure rate analysis of module design qualification testing - IV: 1997–2005 vs. 2005–2007 vs. 2007–2009 vs. 2009–2011

  • Author

    Tamizhmani, G. ; Li, B. ; Arends, T. ; Shisler, W. ; Voropayev, A. ; Parker, D. ; Kroner, K. ; Armstrong, J.

  • Author_Institution
    TUV Rheinland PTL, Tempe, AZ, USA
  • fYear
    2012
  • fDate
    3-8 June 2012
  • Abstract
    Qualification testing of photovoltaic modules, according to IEC 61215 (crystalline silicon) or IEC 61646 (thin-film) standard, may be considered as a minimum requirement for reliability or a prerequisite for any reliability testing. It is a set of well-defined accelerated stress tests with strict pass / fail criteria based on functionality / performance, safety / insulation and visual requirements. This paper, fourth in series from TUV Rheinland PTL, compares the failure rates obtained over 15 years in four consecutive periods: 1997-2005, 2005-2007, 2007-2009 and 2009-2011. This paper also presents a distribution of failures, for the 2009-2011 period, among the four pass criteria defined in the standard: visual failure, dry insulation failure (safety issue), wet resistance failure (safety issue) and performance failure (power drop).
  • Keywords
    IEC standards; elemental semiconductors; failure analysis; semiconductor thin films; silicon; solar cells; AD 1997 to 2005; AD 2005 to 2007; AD 2007 to 2009; AD 2009 to 2011; IEC 61215; IEC 61646; Si; TUV Rheinland PTL; crystalline silicon; dry insulation failure; failure rate analysis; module design qualification testing; performance failure; photovoltaic modules qualification testing; power drop; reliability testing; safety issue; thin-film; visual failure; wet resistance failure; Abstracts; Heating; Indexes; Life estimation; Qualifications; Resistance; Visualization; accelerated testing; failure rate; qualification testing; reliability testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4673-0064-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2012.6318086
  • Filename
    6318086