• DocumentCode
    3521752
  • Title

    Efficient and practical experimental designs for high volume manufacturing

  • Author

    Brunelle, Raymond

  • Author_Institution
    Nat. Semicond. Corp., South Portland, ME, USA
  • fYear
    1991
  • fDate
    20-22 May 1991
  • Firstpage
    139
  • Lastpage
    144
  • Abstract
    An experimental design technique that permits process optimization studies to extend beyond process average response curves and that optimizes with respect to primary (main) variables and secondary (tolerated) variables is described. The method modifies W.J. Diamond´s (1981) approach for the inner array and modifies G. Taguchi´s (1986) approach for a high-volume manufacturing environment and is experimentally efficient. It is capable of estimating average effects of primary and secondary variables, effects of primary variable process variances, and the process average/variance interrelationship. In using advanced experimental design techniques, three major goals have been achieved; (1) increased manufacturability, (2) improved quality, as shown by a reduction in outgoing DPPM levels, and (3) streamlined assembly processes and decreased cycle time
  • Keywords
    integrated circuit manufacture; process control; quality control; National Semiconductor; decreased cycle time; experimental design technique; experimental design techniques; experimentally efficient; high-volume manufacturing environment; improved quality; increased manufacturability; inner array; major goals; practical experimental designs; primary variable process variances; process average/variance interrelationship; process optimization studies; secondary variables; streamlined assembly processes; Assembly; Design engineering; Design for experiments; Design optimization; Engineering management; Integrated circuit manufacture; Manufacturing processes; Response surface methodology; Semiconductor device manufacture; US Department of Energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1991. ISMSS 1991., IEEE/SEMI International
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    0-7803-0027-0
  • Type

    conf

  • DOI
    10.1109/ISMSS.1991.146283
  • Filename
    146283