Effects of PCB dynamic responses on solder joint stress

Author

An, Tong ; Qin, Fei

Author_Institution

Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

370

Lastpage

373

Abstract

The reliability of board level electronic package subjected to drop impact loadings is one of the most concerned issues. In this paper, a standard board level drop impact test was modeled as double cantilever beam model. The deflection and curvature of the Printed Circuit Board (PCB) and the component were compared with that derived from static analysis in order to understand the influence of dynamic response of the PCB on the solder joints. The results show that the difference of flexibility between the PCB and the package is the main driver for solder joint stress; the dynamic response of the PCB observably affects the stress in solder joints.

Keywords

dynamic response; electronics packaging; impact testing; printed circuit testing; soldering; PCB dynamic responses; board level electronic packaging; double cantilever beam model; drop impact loadings; printed circuit board; solder joint stress; static analysis; Compressive stress; Driver circuits; Educational institutions; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Finite element methods; Soldering; Tensile stress; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270729

Filename

5270729