Title :
Effects of PCB dynamic responses on solder joint stress
Author :
An, Tong ; Qin, Fei
Author_Institution :
Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China
Abstract :
The reliability of board level electronic package subjected to drop impact loadings is one of the most concerned issues. In this paper, a standard board level drop impact test was modeled as double cantilever beam model. The deflection and curvature of the Printed Circuit Board (PCB) and the component were compared with that derived from static analysis in order to understand the influence of dynamic response of the PCB on the solder joints. The results show that the difference of flexibility between the PCB and the package is the main driver for solder joint stress; the dynamic response of the PCB observably affects the stress in solder joints.
Keywords :
dynamic response; electronics packaging; impact testing; printed circuit testing; soldering; PCB dynamic responses; board level electronic packaging; double cantilever beam model; drop impact loadings; printed circuit board; solder joint stress; static analysis; Compressive stress; Driver circuits; Educational institutions; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Finite element methods; Soldering; Tensile stress; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270729
