Simulation of fluid flow and heat transfer in microchannel cooling for LTCC electronic packages

Author

Zhang, J. ; Zhang, Y.F. ; Miao, M. ; Jin, Y.F. ; Bai, S.L. ; Chen, J.Q.

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

327

Lastpage

330

Abstract

The hydrodynamic and thermal characteristics of microchannel networks are investigated by finite element analysis with commercial software Fluent. The simulation model is based on fabricated thick film LTCC substrate with 3D cooling microchannels. A comparison of the cooling performance among fractal-shaped microchannel, parallel microchannel, serpentine microchannel, spiral microchannel is also conducted numerically based on the same heat flux and the same mass flow rate. It is found that fractal-shaped microchannel facilitates the lowest fluid pressure drop and the most uniform temperature distribution over the substrate, and that the spiral microchannel network enables the smallest temperature rise.

Keywords

ceramic packaging; cooling; finite element analysis; flow simulation; heat transfer; hydrodynamics; microchannel flow; temperature distribution; 3D cooling microchannels; LTCC electronic packages; commercial software Fluent; fabricated thick film LTCC substrate; finite element analysis; fluid flow simulation; fluid pressure drop; fractal-shaped microchannel; heat flux; heat transfer; hydrodynamic characteristics; mass flow rate; parallel microchannel; serpentine microchannel; spiral microchannel; temperature distribution; thermal characteristics; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Fluid flow; Fractals; Heat transfer; Microchannel; Spirals; Substrates; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270740

Filename

5270740