Modeling thermal fatigue in anisotropic Sn-Ag-Cu/Cu solder joints

Author

Yang, Shihua ; Tian, Yanhong ; Wang, Chunqing ; Huang, Tengfei

Author_Institution

Dept. of Electron. Packaging Technol., Harbin Inst. of Technol., Harbin, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

288

Lastpage

289

Abstract

Properties of body-centered tetragonal beta-Sn are highly anisotropic. The crystal orientation of the beta-Sn has a marked effect on the stress state in the SnAgCu solder joints. A finite element analysis has been performed of the thermal cycling of the SnAgCu solder and solder joints. Significant amounts of stresses at the solder/Cu interface and in the plane of the grain boundary was found. The best Sn grain orientation is perpendicular to the solder/Cu interface.

Keywords

copper alloys; crystal orientation; finite element analysis; grain boundaries; silver alloys; soldering; solders; thermal analysis; thermal stress cracking; tin alloys; Sn-Ag-Cu; anisotropic solder joints; crystal orientation; finite element analysis; grain boundary; grain orientation; thermal cycling; thermal fatigue modeling; Anisotropic magnetoresistance; Copper alloys; Fatigue; Finite element methods; Grain boundaries; Lead; Soldering; Temperature distribution; Thermal stresses; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270748

Filename

5270748