Title :
An Interleave-Division multiplexing (IDM) based modulation for 3GPP LTE downlink
Author :
Chen, Dageng ; Wang, Yi ; Zhang, Jiayin
Author_Institution :
Huawei Technol. Co., Ltd., Shanghai
Abstract :
Interleave-division multiple-access (IDMA) is an efficient multiple access technique to improve high spectrum efficiency for cellular communications. In this paper IDM-based modulation (called layered modulation (LM)) is proposed for OFDM systems. The idea of LM is to multiplex multiple parallel layers of data streams by performing repetition and layer-specific interleaver on each layer. Since LM code bits are fully distributed in time-frequency plane, by the aid of low-complexity chip-by-chip interference cancellation time-frequency diversity can be well exploited in LM. Applying LM to 3GPP LTE downlink, we compare LM to M-PSK/QAM modulation. Numerical results show that the LM can achieve superior performance over M-PSK/QAM. The performance gain over QPSK, 8PSK and 16QAM is 1.1 dB, 2.2 dB and 0.6 dB, respectively.
Keywords :
3G mobile communication; OFDM modulation; cellular radio; computational complexity; diversity reception; interference suppression; multi-access systems; radiofrequency interference; 16QAM; 3GPP LTE downlink; 8PSK; LM code bits; M-PSK-QAM modulation; OFDM systems; QPSK; cellular communications; chip-by-chip interference cancellation; gain 0.6 dB; gain 1.1 dB; gain 2.2 dB; interleave-division multiple-access; interleave-division multiplexing based modulation; layer-specific interleaver; layered modulation; multiple parallel layer multiplexing; time-frequency diversity; time-frequency plane; Channel coding; Downlink; Frequency diversity; Multiaccess communication; Multiuser detection; OFDM modulation; Performance gain; Quadrature amplitude modulation; Time frequency analysis; Transmitters; Code Divison Multiple Access (CDMA); Interleave-Division Multiple-Access (IDMA); Layered-Modulation (LM); Orthogonal Frequency Division Multiplexing (OFDM);
Conference_Titel :
Communications and Networking in China, 2008. ChinaCom 2008. Third International Conference on
Conference_Location :
Hangzhou
Print_ISBN :
978-1-4244-2373-6
Electronic_ISBN :
978-1-4244-2374-3
DOI :
10.1109/CHINACOM.2008.4685068