Fracture simulation of solder joint interface by Cohesive Zone Model

Author

An, Tong ; Qin, Fei

Author_Institution

Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

260

Lastpage

266

Abstract

In this paper, the damage fracture of solder joints in board level electronic package subjected to drop impact loadings was numerically simulated by the finite element method and the cohesive zone model. The solder-Cu pad interface was modeled by cohesive zone elements. The results show that fracture initiates at the edge of the PCB side and the damage of solder joint is affected greatly by the used material constitutive model in the simulation.

Keywords

copper; electronics packaging; failure analysis; finite element analysis; fracture; impact (mechanical); printed circuits; solders; PCB; board level electronic package; cohesive zone elements; cohesive zone model; drop impact loadings; finite element method; material constitutive model; numerical simulation; printed circuit board; solder joint damage fracture simulation; solder joint interface; solder-copper pad interface; Electronics packaging; Environmentally friendly manufacturing techniques; Failure analysis; Fatigue; Finite element methods; Joining materials; Lead; Numerical simulation; Plastics; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270751

Filename

5270751