• DocumentCode
    3522393
  • Title

    Molecular dynamics of nanofluids with time-dependent thermal conductivity in heat sink dissipation

  • Author

    Wang, Xiaojing ; Liu, Hongjun ; Zhang, Wen ; Li, Zongshuo ; Chen, Ling

  • Author_Institution
    Shanghai Univ. Shanghai Univ., Shanghai, China
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    230
  • Lastpage
    233
  • Abstract
    Since the pioneering work by Tuckerman & Pease, lots of publications about heat sink have been researched in the last decade. Many enhancements are suggested in order to increase the critical heat current of heat sink including nanofluids which are solid-liquid mixtures composed of nanoparticles and basic liquid. The values of the thermal properties of nanofluids are enhanced to a large degree, even when the concentration of the nanoparticles is non-ignorably small. Molecular dynamics (MD) method can be used to generate and accurately trace the trajectories of the simulated particles and the interaction of the nanoparticles with the base fluid. In this study, MD is used to simulate the thermal conductivity of nanofluids obtained from the non-equilibrium MD (NEMD) approach under different temperatures. And simulations are based on the commercial software package FLUENT and treating the nanofluids as a two-phase mixture. Thermal resistance of four different coolants with different inlet velocities and heating powers are computed. Results show temperature-dependent thermal conductivity can´t be neglected while simulating especially when the inlet velocity is large and the heating power is low.
  • Keywords
    heat sinks; microchannel flow; molecular dynamics method; nanofluidics; nanoparticles; thermal conductivity; thermal resistance; FLUENT software package; critical heat current; heat sink dissipation; heating power; inlet velocity; microchannel flow; nanofluids; nanoparticles; nonequilibrium molecular dynamics method; solid-liquid mixtures; thermal resistance; time-dependent thermal conductivity; two-phase mixture; Computational modeling; Coolants; Fluid dynamics; Heat sinks; Nanoparticles; Resistance heating; Software packages; Temperature; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270757
  • Filename
    5270757