Title :
Localized induction heating for wafer level packaging
Author :
Chen, Mingxiang ; Liu, Wenming ; Xi, Yanyan ; Lin, Changyong ; Liu, Sheng
Author_Institution :
Div. of MOEMS, Wuhan Nat. Lab. for Optoelectron., Wuhan, China
Abstract :
Localized induction heating for wafer level packaging is discussed. This paper is to investigate the relationships between the geometry of solder loop and temperature distribution in induction heating. Using finite element method (FEM) and IR thermal imager, temperature distribution and variation are explored, which shows that the temperature on the solder loops is a function of the area and edge width in the induction heating. The temperature difference between the solder loop and its center on PCB is about 180degC, which shows an obvious localized heating effect. Thermal images of circle and square solder array indicate uniform temperature distribution on the PCB in the induction heating. Good agreement between measured and simulated temperature variation have been achieved.
Keywords :
finite element analysis; induction heating; infrared imaging; solders; wafer level packaging; IR thermal imager; PCB; circle solder array; finite element method; induction heating; solder loop; square solder array; temperature distribution; wafer level packaging; Electromagnetic heating; Finite element methods; Frequency; Heat transfer; Integrated circuit packaging; Magnetic materials; Resistance heating; Temperature distribution; Temperature measurement; Wafer scale integration;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270760