Title :
Modeling of manufacturing processes of high power light emitting diodes: Wire bonding process
Author :
Chen, Zhaohui ; Liu, Yong ; Liu, Sheng
Author_Institution :
Res. Inst. of Micro/Nano Sci. & Technol., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
In this paper, the wire bonding process of high power light emitting diodes (LED), which was simplified to consist of impact and vibration stages, was investigated by using a nonlinear finite element method. Parametric studies were carried out to examine the effects of the ultrasonic vibration amplitude, the friction coefficient between the free air ball (FAB) and bond pad, the incline of LED chip on stress and strain distribution in the bond pad and ohmic contact layer of both p-type and n-type electrode structure. This numerical simulation work may provide guidelines for the wire bonding process virtual window development of high power lighting emitting diodes package.
Keywords :
electrodes; finite element analysis; friction; impact (mechanical); lead bonding; light emitting diodes; ohmic contacts; vibrations; bond pad; free air ball; friction coefficient; high-power light emitting diodes; impact stage; manufacturing processes; n-type electrode structure; nonlinear finite element method; ohmic contact layer; p-type electrode structure; strain distribution; stress distribution; ultrasonic vibration effects; vibration stage; virtual window development; wire bonding process; Bonding processes; Capacitive sensors; Finite element methods; Friction; Light emitting diodes; Manufacturing processes; Ohmic contacts; Parametric study; Stress; Wire;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270768
