Finite element thermal analysis for high power multi-chip light emitting diode

In this paper, finite element method (FEM) numerical thermal simulation is performed on the given packaging configuration, and temperature as well as heat flux distribution are obtained. An optimal packaging configuration is obtained by simulating different materials and structures of the heat sink, submount, die attach, different die arrangement styles and die spacing parameters. A reasonable simplification for the high power multi-chip light emitting diode packaging body is performed and a precise FE model is established, and then a high-quality meshing is carried out. A comprehensive simulation is performed to get the temperature distribution of the chip for different materials and structure parameters of certain components; the mechanism of the change of the temperature is analyzed. Simulation results show that an ideal temperature for chip junction under standard input power on the normal working conditions can be obtained through appropriate selection of heat sink structure and material, sub-mount material and structure parameter, die attach material and structure parameter, die arrangement style and spacing parameter.