DocumentCode
3522761
Title
Solderability of flash gold surface finish
Author
Wang, Yuming ; Dong, Mingzhi ; Cai, Jian
Author_Institution
Tsinghua-Flextronics SMT Lab., Beijing, China
fYear
2009
fDate
10-13 Aug. 2009
Firstpage
152
Lastpage
156
Abstract
Flash gold with nickel and gold plating is a low-cost technique in PCB finishing, frequently used in the production of toys. The quality of plating has become one of the concerns for the performance and reliability of solderability. This study investigates the solderability of PCB produced by flash gold finish and traditional nickel and gold plating finish. For this purpose, solderability tests have been conducted. The test results with both techniques of plating layers are analyzed and compared. Their impact on solderability of PCB is discussed.
Keywords
gold; printed circuits; reliability; solders; surface finishing; Au; PCB; flash gold; plating layers; reliability; solderability tests; surface finish; Electronic equipment testing; Environmentally friendly manufacturing techniques; Fixtures; Gold; Laboratories; Lead; Nickel; Soldering; Surface finishing; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4658-2
Electronic_ISBN
978-1-4244-4659-9
Type
conf
DOI
10.1109/ICEPT.2009.5270773
Filename
5270773
Link To Document