Title :
Solderability of flash gold surface finish
Author :
Wang, Yuming ; Dong, Mingzhi ; Cai, Jian
Author_Institution :
Tsinghua-Flextronics SMT Lab., Beijing, China
Abstract :
Flash gold with nickel and gold plating is a low-cost technique in PCB finishing, frequently used in the production of toys. The quality of plating has become one of the concerns for the performance and reliability of solderability. This study investigates the solderability of PCB produced by flash gold finish and traditional nickel and gold plating finish. For this purpose, solderability tests have been conducted. The test results with both techniques of plating layers are analyzed and compared. Their impact on solderability of PCB is discussed.
Keywords :
gold; printed circuits; reliability; solders; surface finishing; Au; PCB; flash gold; plating layers; reliability; solderability tests; surface finish; Electronic equipment testing; Environmentally friendly manufacturing techniques; Fixtures; Gold; Laboratories; Lead; Nickel; Soldering; Surface finishing; Temperature;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270773
