Process research of LTCC substrate with 3D micro-channel embedded

Along with the development of the electrical technology, the power of the circuit rises rapidly, heat dissipation becomes a key problem in the design of the circuit. The 3D microchannel coolers made with LTCC (low temperature co-fire ceramic) technology can absorb the heat of the chip and pass it to the external environment by the liquid circulation. In this paper, the critical manufacturing processes of LTCC multilayer substrate with 3D micro-channel embedded: lamination and sintering are studied mainly. The special lamination sacrificial layer technique can prevent the 3D micro-channel from collapsing and deforming during the lamination. In addition, the sintering profile is optimized which helps avoid the crazing and delamination of the multi-layer substrate. In conclusion, the intact LTCC substrate with 3D micro-channel embedded can be fabricated using the optimized lamination and sintering process parameters, which makes the following heat dissipation experiment and design optimization more conveniently.