Ecodesign technical committee of JIEP (Japan Institute of Electronics Packaging) and its activity

Author

Hayashi, Hidetaka

Author_Institution

Eco-Design & Jisso Tech. Comm. of JIEP, NPO Ecodesign Promotion Network, Japan

fYear

2009

fDate

10-13 Aug. 2009

Firstpage

52

Lastpage

55

Abstract

The discussions on environmental issue in electronics industry in the past are mostly on the regulation oriented technical issues to follow the needs of rapid increase on environmental regulations. We have reported in JIEP (Japan Institute of Electronics Packaging) session in EcoDesign2001 as EcoDesign JIEP Tomorrow [1]. Even if there are still many disputes, we could show the electronics industry in Japan is about to full fill most of all requirements stated in EcoDesign for tomorrow that was based on the global regulative scheme until 2010. Then our focus should shift to the future task that is more radical and challenging but difficult one. This paper introduces activity of JIEP and EcoDesign & Jisso Technical Committee in the past and direction of study forward to the future. We pay special attention on saving, reliability on RoHS alternative material, reliability on easy decomposition structure, lifetime extension and emerging new technologies for the future. Those subjects are sometimes in trade-off relations of performance and environmental aspect.

Keywords

RoHS compliance; design for environment; electronics industry; electronics packaging; EcoDesign Technical Committee; JIEP; Japan Institute of Electronics Packaging; RoHS alternative material; electronics industry; environmental issue; environmental regulations; Electronic circuits; Electronic waste; Electronics industry; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing; Materials reliability; Paramagnetic resonance; Recycling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-4658-2

Electronic_ISBN

978-1-4244-4659-9

Type

conf

DOI

10.1109/ICEPT.2009.5270795

Filename

5270795