• DocumentCode
    3523316
  • Title

    Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging

  • Author

    Wang, Changhai ; Zeng, Jun ; Liu, Yufei

  • Author_Institution
    Sch. of Eng. & Phys. Sci., Heriot Watt Univ., Edinburgh, UK
  • fYear
    2009
  • fDate
    10-13 Aug. 2009
  • Firstpage
    31
  • Lastpage
    35
  • Abstract
    This paper presents the recent advances in the development of a laser assisted fast polymer bonding method for electronic packaging applications. In this method a high power diode laser is used to cure a polymer adhesive material to bond substrates together. A unique beam forming method using custom designed optical phase plate elements was developed to transform a fiber delivered laser beam into top-hat and frame shaped beam profiles for energy efficient polymer bonding for electronics manufacturing. In addition it has been found that the frame shaped beam profile can produce a desirable temperature distribution for MEMS packaging in which the surface temperature at the center of the substrate is lower by ~50degC than the packaging temperature (~300degC) when bonding a glass cap to a silicon substrate. An accurate temperature monitoring method using an embedded thin film microsensor array has been developed and has been used successfully for process monitoring. Defect-free fast bonding (~10 seconds) of transparent cap (glass) and non-transparent cap (silicon) to a silicon chip has been demonstrated. This work illustrates the potential of the diode laser based photonic technology for advanced MEMS packaging and electronics manufacturing.
  • Keywords
    bonding processes; electronics packaging; glass; integrated optoelectronics; micromechanical devices; microsensors; polymers; semiconductor lasers; sensor arrays; silicon; temperature distribution; thin film sensors; MEMS packaging; Si; SiO2Jk-Si; beam forming method; bond substrates; defect-free fast bonding; electronic packaging applications; electronics manufacturing; embedded thin film microsensor array; frame shaped beam profile; glass cap; high-power diode laser; intermediate layer bonding; laser assisted polymer bonding; nontransparent cap; optical phase plate elements; photonic technology; polymer adhesive material; silicon chip; silicon substrate; surface temperature; temperature distribution; temperature monitoring method; transparent cap; Bonding; Diode lasers; Electronics packaging; Fiber lasers; Laser beams; Micromechanical devices; Polymers; Silicon; Substrates; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4658-2
  • Electronic_ISBN
    978-1-4244-4659-9
  • Type

    conf

  • DOI
    10.1109/ICEPT.2009.5270799
  • Filename
    5270799