Abstract :
The following topics are dealt with: electronic packaging; high density packaging; high density substrate; SMT; and packaging design.
Keywords :
packaging; SMT; electronic packaging; high density packaging; high density substrate; packaging design;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
DOI :
10.1109/ICEPT.2009.5270805
