DocumentCode :
3523464
Title :
[Title page]
fYear :
2009
fDate :
10-13 Aug. 2009
Firstpage :
1
Lastpage :
1
Abstract :
The following topics are dealt with: electronic packaging; high density packaging; high density substrate; SMT; and packaging design.
Keywords :
packaging; SMT; electronic packaging; high density packaging; high density substrate; packaging design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Type :
conf
DOI :
10.1109/ICEPT.2009.5270805
Filename :
5270805
Link To Document :
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