• DocumentCode
    3523712
  • Title

    Optimized Charge Simulation Models of Horizontal Sphere Gaps

  • Author

    Kishore, N.K. ; Punekar, Gururaj S. ; Shastry, H.S.Y.

  • Author_Institution
    Indian Inst. of Technol., Kharagpur
  • fYear
    2006
  • fDate
    15-18 Oct. 2006
  • Firstpage
    27
  • Lastpage
    30
  • Abstract
    The horizontal sphere gap is modeled using six point charges per electrode as a test case. Two intuitively felt optimized charge simulation method (OCSM) models of horizontal sphere gap arrangement are set up by selectively changing degree of freedom to understand its effect on the simulation errors. The optimal location of charges is obtained using genetic algorithm (GA). A large number of numerical experiments are conducted by varying potential assigned to the low potential sphere, height of the spheres above the ground plane and gap separation. Lower potential sphere always shows higher error. For a typical case, the maximum surface potential error with increased freedom in locating charges reduced to 4% from its earlier value of 9.5%. The simulations with symmetrical supply show maximum surface potential error of 1.0% on both the spheres. On the other hand simulating a ground potential electrode near a high voltage electrode involves more errors and hence more effort. The charge simulation method being semi analytical technique, the shape of the geometry and symmetry (if any) plays a major role and setting up accurate OCSM model still requires user experience.
  • Keywords
    electric breakdown; genetic algorithms; high-voltage engineering; insulators; space charge; surface potential; voltage measurement; charge simulation method; gap separation; genetic algorithm; ground plane; ground potential electrode; horizontal sphere gap; low potential sphere; maximum surface potential error; optimized charge simulation model; six point charges per electrode; sphere height; Analytical models; Boundary conditions; Computational modeling; Electrodes; Genetic algorithms; Geometry; Guidelines; Shape; Solid modeling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2006 IEEE Conference on
  • Conference_Location
    Kansas City, MO
  • Print_ISBN
    1-4244-0547-5
  • Electronic_ISBN
    1-4244-0547-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.2006.312054
  • Filename
    4105362