DocumentCode :
35246
Title :
IEEE Transactions on Device and Materials Reliability information for authors
Volume :
14
Issue :
2
fYear :
2014
fDate :
Jun-14
Abstract :
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2014.2326439
Filename :
6824889
Link To Document :
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