Optoelectronic CMOS-SEED smart pixels

Author

Chen, HongDa ; Zeng, Qingming ; Li, Xizihjie ; Chen, Zhibiao ; Du, Yun ; Zhang, Yi ; Liang, Kun ; Wu, Ronghan

Author_Institution

Inst. of Semicond., Acad. Sinica, Beijing, China

Volume

2

fYear

1999

fDate

18-22 Oct. 1999

Firstpage

1565

Abstract

We have made optoelectronic smart pixels using a hybrid integration of GaAs/AlGaAs multiple quantum well (MQW) self- electro-optic effect device (SEED) arrays flip-chip bonded directly on the top of a 1 /spl mu/m silicon CMOS circuits. This enables optoelectronic integrated circuits (OEIC) to be achieved and also the design and optimization of the CMOS circuits and the GaAs/AlGaAs multiple quantum well devices to proceed independently.

Keywords

CMOS integrated circuits; III-V semiconductors; SEEDs; aluminium compounds; flip-chip devices; gallium arsenide; integrated optoelectronics; quantum well devices; semiconductor quantum wells; smart pixels; CMOS-SEED smart pixels; GaAs-AlGaAs; GaAs/AlGaAs multiple quantum well devices; MQW; OEIC; Si; Si CMOS circuits; flip-chip bonding; hybrid integration; optoelectronic integrated circuits; optoelectronic smart pixels; self electro-optic effect device arrays; Circuits; Electrooptic devices; Gallium arsenide; High speed optical techniques; Optical arrays; Optical modulation; Optoelectronic devices; Quantum well devices; Silicon; Smart pixels;

fLanguage

English

Publisher

ieee

Conference_Titel

Communications, 1999. APCC/OECC '99. Fifth Asia-Pacific Conference on ... and Fourth Optoelectronics and Communications Conference

Conference_Location

Beijing, China

Print_ISBN

7-5635-0402-8

Type

conf

DOI

10.1109/APCC.1999.820586

Filename

820586