DocumentCode :
3526582
Title :
Nanometer-order base length, sharp and uniform field emitter arrays fabricated by transfer mold method
Author :
Nakamoto, Masayuki ; Moon, Jonghyun ; Shiratori, Koji ; Sugiyama, Yasushi
Author_Institution :
Res. Inst. of Electron., Shizuoka Univ., Hamamatsu, Japan
fYear :
2009
fDate :
20-24 July 2009
Firstpage :
167
Lastpage :
177
Abstract :
In this paper nanometer-order base length, sharp and uniform field emitter arrays with 64 nm base length and 2.5 nm tip radius, which is the smallest and sharpest FEAs ever reported, have been developed by transfer mold method to realize the uniform and stable field emission characteristics. The reverse-pyramidal shape mold with thin SiO2 layer for sharpness was fabricated by using e-beam lithography. It was formed on Si substrates by anisotropic etching, on which emitter materials Ni thin-film are deposited using ultrafine electroplating method. The emitter film was bonded to another substrate, and then the Si-mold substrate was removed entirely. Resultantly, the sharpened emitter array could be obtained reproducibly and uniformly.Thus nanostructure Ni-FEAs have been developed using by transfer mold method with high uniformity and reliability. The nanostructure transfer mold FEAs with 64-nm-base length can be useful for field emission device and vacuum nanodevice.
Keywords :
electron beam lithography; electroplating; etching; field emitter arrays; nanoelectronics; nickel; thin films; FEAs; Ni; anisotropic etching; e-beam lithography; field emission device; field emitter arrays fabrication; reverse-pyramidal shape mold; size 2.5 nm; size 64 nm; stable field emission characteristics; thin-film deposition; transfer mold method; ultrafine electroplating method; vacuum nanodevice; Anisotropic magnetoresistance; Etching; Field emitter arrays; Lithography; Nanoscale devices; Nanostructured materials; Semiconductor thin films; Shape; Sputtering; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Nanoelectronics Conference, 2009. IVNC 2009. 22nd International
Conference_Location :
Shizuoka
Print_ISBN :
978-1-4244-3587-6
Electronic_ISBN :
978-1-4244-3588-3
Type :
conf
DOI :
10.1109/IVNC.2009.5271600
Filename :
5271600
Link To Document :
بازگشت