Title :
Photonics intensive packaging system using a new flexible fiber wiring board with "apertures"
Author :
Koike, Shinji ; Kawajiri, Yijko ; Ishii, Yuzo ; Arai, Yoshimitsu ; Ando, Yasuhiro
Author_Institution :
NTT Telecommun. Energy Labs., Tokyo, Japan
Abstract :
We have proposed and demonstrated a new photonics intensive packaging system and related board configuration using a fiber wiring board with "apertures" for interconnecting multichip modules having massively parallel optical I/O.
Keywords :
integrated optics; multichip modules; optical communication equipment; optical fibre communication; optical interconnections; parallel architectures; apertures; board configuration; flexible fiber wiring board; interconnections; massively parallel optical I/O; multichip modules; photonics intensive packaging system; Apertures; High speed optical techniques; Integrated circuit interconnections; Multichip modules; Optical fibers; Optical interconnections; Optical mixing; Packaging; Photonics; Wiring;
Conference_Titel :
Communications, 1999. APCC/OECC '99. Fifth Asia-Pacific Conference on ... and Fourth Optoelectronics and Communications Conference
Conference_Location :
Beijing, China
Print_ISBN :
7-5635-0402-8
DOI :
10.1109/APCC.1999.820623
