DocumentCode
3526782
Title
Photonics intensive packaging system using a new flexible fiber wiring board with "apertures"
Author
Koike, Shinji ; Kawajiri, Yijko ; Ishii, Yuzo ; Arai, Yoshimitsu ; Ando, Yasuhiro
Author_Institution
NTT Telecommun. Energy Labs., Tokyo, Japan
Volume
2
fYear
1999
fDate
18-22 Oct. 1999
Firstpage
1674
Abstract
We have proposed and demonstrated a new photonics intensive packaging system and related board configuration using a fiber wiring board with "apertures" for interconnecting multichip modules having massively parallel optical I/O.
Keywords
integrated optics; multichip modules; optical communication equipment; optical fibre communication; optical interconnections; parallel architectures; apertures; board configuration; flexible fiber wiring board; interconnections; massively parallel optical I/O; multichip modules; photonics intensive packaging system; Apertures; High speed optical techniques; Integrated circuit interconnections; Multichip modules; Optical fibers; Optical interconnections; Optical mixing; Packaging; Photonics; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications, 1999. APCC/OECC '99. Fifth Asia-Pacific Conference on ... and Fourth Optoelectronics and Communications Conference
Conference_Location
Beijing, China
Print_ISBN
7-5635-0402-8
Type
conf
DOI
10.1109/APCC.1999.820623
Filename
820623
Link To Document