Title :
High reliability hybrid planar lightwave circuit module integrated with a preamplifier using a plastic package for optical access networks
Author :
Kudo, Miyuki ; Terashima, Tokihiro ; Nakamura, Tsutomu
Author_Institution :
Oki Electr. Ind. Co. Ltd., Tokyo, Japan
Abstract :
We have developed a low cost and hybrid integrated planar lightwave circuit module with passive alignment technology for fiber to the home systems. We succeeded in the development of the high reliability plastic package type module.
Keywords :
hybrid integrated circuits; integrated circuit packaging; integrated circuit reliability; modules; optical fibre subscriber loops; plastics; preamplifiers; FTTH; fiber to the home systems; high reliability module; high reliability plastic package; hybrid integrated circuit module; hybrid planar lightwave circuit module; optical access networks; passive alignment technology; plastic package; preamplifier; Costs; Integrated circuit reliability; Metalworking machines; Optical filters; Optical network units; Optical receivers; Packaging; Plastics; Programmable control; Programmable logic arrays;
Conference_Titel :
Communications, 1999. APCC/OECC '99. Fifth Asia-Pacific Conference on ... and Fourth Optoelectronics and Communications Conference
Conference_Location :
Beijing, China
Print_ISBN :
7-5635-0402-8
DOI :
10.1109/APCC.1999.820627
