• DocumentCode
    3526939
  • Title

    Three dimensional ALD of TiO2 for in-vivo biomedical sensor applications

  • Author

    Schroder, Sven ; Dogan, Ozgu ; Schneidewind, Jessica ; Bertotti, Gabriel ; Keil, Stefan ; Gargouri, Hassan ; Arens, Michael ; Brose, Evelin ; Bruns, Jurgen ; Wolansky, Dirk ; Tillack, Bernd ; Vassanelli, Stefano ; Szyszka, Bernd ; Thewes, Roland

  • Author_Institution
    Fac. of Electr. Eng. & Comput. Sci., Tech. Univ. Berlin, Berlin, Germany
  • fYear
    2015
  • fDate
    18-19 June 2015
  • Firstpage
    21
  • Lastpage
    24
  • Abstract
    Titanium dioxide, known as a high-k biocompatible dielectric transducer material, is processed by means of ALD and applied to a 3D structure with dimensions typical for multi-site multi-channel in-vivo neural interfaces. High uniformity, high areal capacitance, and in particular low leakage current densities are achieved within a sufficiently wide operation voltage window. The results demonstrate the suitability of this process to provide dielectric interfaces for 3D biomedical applications.
  • Keywords
    atomic layer deposition; bioelectric phenomena; biomedical materials; biomedical measurement; biomedical transducers; dielectric materials; leakage currents; materials preparation; neurophysiology; titanium compounds; 3D structure; TiO2; areal capacitance; atomic layer deposition; dielectric interface; high-k biocompatible dielectric transducer material; in vivo biomedical sensor application; leakage current density; multi-site multi-channel in vivo neural interface; operation voltage window; three dimensional ALD; titanium dioxide processing; uniformity; Capacitance; Current measurement; Dielectric measurement; Dielectrics; Electrodes; Silicon; Tin; TiO2; atomic layer deposition (ALD); biochip; in-vivo neural interfaces;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advances in Sensors and Interfaces (IWASI), 2015 6th IEEE International Workshop on
  • Conference_Location
    Gallipoli
  • Type

    conf

  • DOI
    10.1109/IWASI.2015.7184978
  • Filename
    7184978