Reliability study of sub 100 micron pitch, flex-to-ITO/glass interconnection, bonded with an anisotropic conductive film

Author

Murray, Cameron T. ; Hogerton, Peter B. ; Chheang, Theary ; Rudman, Robert L. ; Egeberg, Harry

Author_Institution

Bonding Syst. Div., 3M Company, St. Paul, MN, USA

fYear

2000

fDate

2000

Firstpage

200

Lastpage

204

Abstract

The objective of this study was to qualify a 3M Z-Axis (anisotropic) conductive film for use in applications calling for sub 100 μm pitch flex to ITO/glass connections. For the environmental stability tests, the following accelerated aging conditions were studied: 100°C dry, 125°C dry, -40°C/100°C cycle, -55° C/125°C shock, 60° C/95%RH and 85° C/85%RH. We examined both the electrical and peel performance of these bonds after environmental aging

Keywords

adhesion; adhesives; ageing; assembling; circuit reliability; conducting polymers; environmental testing; fine-pitch technology; glass; interconnections; printed circuit manufacture; printed circuit testing; stability; -55 to 125 C; 100 micron; 3M Z-Axis conductive film; ITO; InSnO; accelerated aging conditions; anisotropic conductive film; bonding; electrical performance; environmental aging; environmental stability tests; flex-to-ITO/glass interconnection; peel performance; reliability study; Anisotropic conductive films; Anisotropic magnetoresistance; Bonding; Conducting materials; Conductive adhesives; Curing; Electric resistance; Glass; Integrated circuit interconnections; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000. Proceedings. 4th International Conference on

Conference_Location

Espoo

Print_ISBN

0-7803-6460-0

Type

conf

DOI

10.1109/ADHES.2000.860599

Filename

860599