• DocumentCode
    3529271
  • Title

    Design, fabrication and modeling of microbeam structures for gas sensor applications in CMOS technology

  • Author

    Voiculescu, Ioana ; Zaghloul, Mona ; McGill, R. Andrew

  • Author_Institution
    Dept. of Electr. & Comput. Eng., George Washington Univ., DC, USA
  • Volume
    3
  • fYear
    2003
  • fDate
    25-28 May 2003
  • Abstract
    In this paper we discuss the design, fabrication, and modeling of an electrostatically actuated transducer that is operated in a resonant mode. The transducer is designed for gas sensor applications. The microstructure with high-aspect ratio laminated beam or bridge suspensions, has been fabricated using a 0.6 μm three metal, double poly CMOS process. The fabricated chip was post processed by a sequence of two maskless dry etching steps. A thin sorbent polymer layer is included in the design of the microbeam chemical sensor. The devices were designed to provide a relatively large surface area to coat with the sorbent polymer. Gas sorption in the polymer layer can be monitored as a function of the resonant frequency of the device. The device frequency is measured by piezoresistors mounted in a Wheatstone bridge configuration. The fabricated sensors are intended for use in monitoring hazardous gases and vapors. In order to optimize the device resonant frequencies, a variety of microbeam structures were designed with different dimensions. These structures were modeled with a finite element analysis program. A number of selected structures were fabricated in a single chip design.
  • Keywords
    CMOS integrated circuits; adsorption; electrostatic actuators; finite element analysis; gas sensors; integrated circuit layout; micromechanical resonators; microsensors; sputter etching; 0.6 micron; ANSYS simulation; CMOS technology; Wheatstone bridge configuration; bridge suspensions; design; electrostatically actuated transducer; fabrication; finite element analysis program; gas sensor applications; gas sorption; hazardous gas monitoring; high-aspect ratio laminated beam; large surface area; maskless dry etching steps; microbeam chemical sensor; microbeam structures; microstructure; modeling; piezoresistors; resonant frequency; resonant mode operation; single chip design; thin sorbent polymer layer; three metal double poly CMOS process; CMOS technology; Fabrication; Gas detectors; Microstructure; Monitoring; Polymers; Resonance; Resonant frequency; Semiconductor device modeling; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2003. ISCAS '03. Proceedings of the 2003 International Symposium on
  • Print_ISBN
    0-7803-7761-3
  • Type

    conf

  • DOI
    10.1109/ISCAS.2003.1205171
  • Filename
    1205171