DocumentCode :
3529400
Title :
Ultra thin-oxide damage from gate charging during PETEOS deposition processing
Author :
Kim, Youhg Gwan ; Kim, Hazoong ; Youn, Kang-Sik ; Kang, Dae-Gwan ; Hwang, Jeong-Mo
Author_Institution :
R&D Div., Hyundai MicroElectron. Co. Ltd., Chongju, South Korea
fYear :
1999
fDate :
1999
Firstpage :
245
Lastpage :
248
Abstract :
This paper presents a study of plasma-enhanced tetraethylorthosilicate oxide process (PETEOS) induced charging damage to thin gate oxide reliability of p-and n-MOS after gate poly processing. We explain the plasma induced gate oxide charging mechanism with the differences of ultra thin oxide (45 Å) breakdown characteristics of p- and n-MOS capacitors
Keywords :
MOS capacitors; plasma materials processing; semiconductor device breakdown; semiconductor device metallisation; semiconductor device reliability; surface charging; 45 angstrom; MOS capacitors; PETEOS deposition processing; charging damage; gate charging; nMOS capacitors; pMOS capacitors; plasma induced gate oxide charging mechanism; plasma-enhanced tetraethylorthosilicate oxide process; thin gate oxide reliability; ultra thin oxide breakdown characteristics; ultra thin-oxide damage; Capacitors; Dielectrics; Electric breakdown; Plasma density; Plasma materials processing; Plasma measurements; Plasma properties; Plasma sources; Plasma temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI and CAD, 1999. ICVC '99. 6th International Conference on
Conference_Location :
Seoul
Print_ISBN :
0-7803-5727-2
Type :
conf
DOI :
10.1109/ICVC.1999.820894
Filename :
820894
Link To Document :
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