Title :
Design of a combined processor containing a 32-bit RISC microprocessor and a 16-bit fixed-point DSP on a chip
Author :
Jeong, Wookyeong ; An, Sangiun ; Moongyung Kim ; Heo, Sangkyong ; Youngjun Kim ; Moon, Sangook ; Lee, Yongsurk
Author_Institution :
Dept. of Electr. Eng., Yonsei Univ., Seoul, South Korea
Abstract :
In this paper, a combined architecture, YS-RDSP, which merges a RISC microprocessor with a DSP processor to be suitable for embedded applications is proposed and designed. The YS-RDSP can execute maximum 4 instructions in parallel at the same time. In order to reduce the size of programs, the YS-RDSP has variable instruction length of 16-bit and 32-bit. The YS-RDSP provides DSP processing power as well as control power and programmability of RISC microprocessor on a single chip. The YS-RDSP has 8-kbyte ROM and 8-kbyte RAM on chip. System controller which is a peripheral included in the chip provides three power-down modes for low-power operations, and SLEEP instruction switches the operation states of the CPU core and peripherals. The YS-RDSP processor is modeled in Verilog-HDL with top-down design methodology. Verified model is synthesized with 0.6 μm 3.3 V CMOS standard cell library and laid out using automated P&R resulting 10.7 mm by 8.4 mm core area
Keywords :
CMOS digital integrated circuits; digital signal processing chips; embedded systems; fixed point arithmetic; low-power electronics; microprocessor chips; reduced instruction set computing; 0.6 micron; 16 bit; 3.3 V; 32 bit; CMOS chip; RISC microprocessor; SLEEP instruction; Verilog-HDL model; YS-RDSP; combined architecture; embedded system; fixed-point DSP processor; low-power operation; system controller; top-down design; Control systems; Digital signal processing; Digital signal processing chips; Hardware design languages; Microprocessors; Power system modeling; Read only memory; Reduced instruction set computing; Semiconductor device modeling; Switches;
Conference_Titel :
VLSI and CAD, 1999. ICVC '99. 6th International Conference on
Conference_Location :
Seoul
Print_ISBN :
0-7803-5727-2
DOI :
10.1109/ICVC.1999.820913