Millimeter-wave ceramic package for a surface mount

Author

Koriyama, S. ; Kitazawa, K. ; Shino, N. ; Minamiue, H.

Author_Institution

R&D Center, Kyocera Corp., Kagoshima, Japan

Volume

1

fYear

2000

fDate

11-16 June 2000

Firstpage

61

Abstract

A surface mount type millimeter-wave ceramic package has been developed. Total insertion loss of a line on the board, a solder joint and a feedthrough of the package is 1.0 dB at 77 GHz. Standard deviation of the insertion loss is 0.08 dB (n=57). The package employs a feed-through of an electromagnetic coupling structure for vertical transmission of millimeter-wave signal. The electromagnetic coupling consists of microstrip line (MSL), slot, and MSL. General characteristics of the coupling has been studied. We have optimized the dimensions of the electromagnetic coupling to obtain largest margin for the production of ceramic lamination technology. Mass production of the package is now available. The package and its assembly will be key technologies for the new and big markets of millimeter wave application.

Keywords

MIMIC; ceramic packaging; integrated circuit packaging; microstrip lines; surface mount technology; 1.0 dB; 77 GHz; ceramic lamination technology; electromagnetic coupling structure; feedthrough; insertion loss; microstrip line; millimeter-wave ceramic package; millimeter-wave signal; solder joint; surface mount; vertical transmission; Ceramics; Electromagnetic coupling; Insertion loss; Lamination; Mass production; Microstrip; Millimeter wave technology; Optimized production technology; Packaging; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest. 2000 IEEE MTT-S International

Conference_Location

Boston, MA, USA

ISSN

0149-645X

Print_ISBN

0-7803-5687-X

Type

conf

DOI

10.1109/MWSYM.2000.860885

Filename

860885