3-axis amorphous wire type giant magneto-impedance sensors

Author

Cai, C.M. ; Yamamoto, M. ; Aoyama, H. ; Mori, M. ; Honkura, Y.

Author_Institution

Aichi Steel Corp., Japan

fYear

2005

fDate

4-8 April 2005

Firstpage

407

Lastpage

408

Abstract

In the previous, the author reported a 2-axis mass-production of an amorphous wire GMI (giant magneto-impedance) sensor with 10,000 times the sensitivity of the MR sensor. This paper presents a newly developed 3-axis amorphous wire type GMI sensors by adding a new Z axis. The 3D GMI sensor has three orthogonally arranged micro GMI sensor elements and a CMOS signal conditioning IC in a small resin-mold package. And the length of GMI sensor element was shortened from 1.5 mm to 0.8 mm. The world´s smallest, quick response and low power consumption 3D sensor can be used in mobile phones with GPS capability as an electronic compass.

Keywords

CMOS integrated circuits; giant magnetoresistance; magnetic sensors; resins; 1.5 to 0.8 mm; 3-axis amorphous wire; CMOS; GMI sensors; GPS capability; electronic compass; giant magneto-impedance sensors; mobile phones; resin-mold package; Amorphous magnetic materials; Amorphous materials; CMOS integrated circuits; Electronics packaging; Energy consumption; Global Positioning System; Integrated circuit packaging; Magnetic sensors; Mobile handsets; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International

Print_ISBN

0-7803-9009-1

Type

conf

DOI

10.1109/INTMAG.2005.1463632

Filename

1463632