DocumentCode
3530067
Title
Application of eddy-current testing technique for high-density double-layer printed circuit board inspection
Author
Chomsuwan, K. ; Yamada, S. ; Iwahara, M. ; Wakiwaka, H. ; Shoji, S.
Author_Institution
Inst. of Nature & Environ. Technol., Kanazawa Univ., Japan
fYear
2005
fDate
4-8 April 2005
Firstpage
421
Lastpage
422
Abstract
Inspection of high-density double-layer printed circuit board (PCB) should examine both layers to obtain an accurate inspection. Eddy-current testing (ECT) technique is successful for defect inspection on single-layer PCB. In this paper, bare high-density double-layer PCB inspection based on ECT technique is studied. Defect points occurred on both top and scanning only over the top layer identifies bottom layers.
Keywords
eddy current testing; printed circuit testing; printed circuits; defect inspection; defect points; eddy-current testing technique; high-density double-layer printed circuit board; single-layer PCB; Circuit testing; Coils; Conductors; Electrical capacitance tomography; Frequency; Inspection; Magnetic sensors; Printed circuits; Probes; Sensor arrays;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN
0-7803-9009-1
Type
conf
DOI
10.1109/INTMAG.2005.1463639
Filename
1463639
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