DocumentCode
3530989
Title
High-frequency IC packaging technologies
Author
Hirose, Tatsuya
Author_Institution
Fujitsu Labs. Ltd., Atsugi, Japan
fYear
2003
fDate
12-16 May 2003
Firstpage
227
Lastpage
230
Abstract
Recent low-cost and high-performance packaging technology for high frequency applications such as millimeter-wave sensor applications is described in this paper. A flip-chip package and millimeter-wave integrated circuit (MMIC) technologies for commercial use low-cost 76-GHz automotive radar sensors are demonstrated. We employed a through-hole package that provides low-cost manufacturing and good RF performances for the radar sensor. The key to success of utilizing the flip-chip packages is in stabilization of MMICs.
Keywords
MMIC; flip-chip devices; millimetre wave detectors; 76 GHz; MMIC; automotive radar sensors; flip-chip package; high-frequency IC packaging technologies; millimeter-wave integrated circuit; millimeter-wave sensor applications; through-hole package; Automotive engineering; Frequency; Integrated circuit packaging; Integrated circuit technology; MMICs; Manufacturing; Millimeter wave integrated circuits; Millimeter wave radar; Millimeter wave technology; Sensor phenomena and characterization;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials, 2003. International Conference on
Print_ISBN
0-7803-7704-4
Type
conf
DOI
10.1109/ICIPRM.2003.1205355
Filename
1205355
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