Title :
High-frequency IC packaging technologies
Author_Institution :
Fujitsu Labs. Ltd., Atsugi, Japan
Abstract :
Recent low-cost and high-performance packaging technology for high frequency applications such as millimeter-wave sensor applications is described in this paper. A flip-chip package and millimeter-wave integrated circuit (MMIC) technologies for commercial use low-cost 76-GHz automotive radar sensors are demonstrated. We employed a through-hole package that provides low-cost manufacturing and good RF performances for the radar sensor. The key to success of utilizing the flip-chip packages is in stabilization of MMICs.
Keywords :
MMIC; flip-chip devices; millimetre wave detectors; 76 GHz; MMIC; automotive radar sensors; flip-chip package; high-frequency IC packaging technologies; millimeter-wave integrated circuit; millimeter-wave sensor applications; through-hole package; Automotive engineering; Frequency; Integrated circuit packaging; Integrated circuit technology; MMICs; Manufacturing; Millimeter wave integrated circuits; Millimeter wave radar; Millimeter wave technology; Sensor phenomena and characterization;
Conference_Titel :
Indium Phosphide and Related Materials, 2003. International Conference on
Print_ISBN :
0-7803-7704-4
DOI :
10.1109/ICIPRM.2003.1205355
