Title :
Current density effect on magnetic properties of nanocrystalline electroplated Ni80Fe20/Cu composite wires
Author :
Seet, H.L. ; Li, X.P. ; Zhao, Z.J. ; Wong, L.C. ; Zheng, H.M.
Author_Institution :
Dept. of Mechanical Eng., Nat. Univ. of Singapore, Singapore
Abstract :
The effect of the plating current density in nanocrystalline electrodeposition of permalloy on the crystal grain size and consequently on the soft magnetic properties of the deposited layer of Ni80Fe20/Cu composite wire was investigated. X-ray diffraction was used to measure the crystal grain sizes. Transmission electron microscopy was used to verify the grain size values calculated using Scherrer´s formula. The coercivity of the deposited Ni80Fe20 increased while the magneto-impedance effect ratio of the Ni80Fe20/Cu wire decreased for increasing current density in the low current density range (0.6 - 2 A/dm2). Opposite trends for these soft magnetic properties were observed in the high current density range (2 8 A/dm2).
Keywords :
Permalloy; X-ray diffraction; coercive force; composite materials; copper; current density; electrodeposits; grain size; magnetic thin films; magnetoresistance; nanostructured materials; soft magnetic materials; transmission electron microscopy; Ni80Fe20-Cu; Scherrer formula; X-ray diffraction; coercivity; crystal grain size; electroplated composite wires; magnetoimpedance effect ratio; nanocrystalline composite wires; nanocrystalline electrodeposition; permalloy; plating current density effect; soft magnetic properties; transmission electron microscopy; Coercive force; Current density; Grain size; Iron; Magnetic properties; Size measurement; Soft magnetic materials; Transmission electron microscopy; Wire; X-ray diffraction;
Conference_Titel :
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN :
0-7803-9009-1
DOI :
10.1109/INTMAG.2005.1463698