DocumentCode
3531463
Title
Temperature-aware Task Partitioning for Real-Time Scheduling in Embedded Systems
Author
Wang, Zhe ; Ranka, Sanjay ; Mishra, Prabhat
Author_Institution
Dept. of Comput. & Inf. Sci. & Eng., Univ. of Florida, Gainesville, FL, USA
fYear
2012
fDate
7-11 Jan. 2012
Firstpage
161
Lastpage
166
Abstract
Both power and heat density of on-chip systems are in- creasing exponentially with Moore´s Law. High temperature negatively affects reliability as well the costs of cooling and packaging. In this paper, we propose task partitioning as an effective way to reduce the peak temperature in embedded systems running either a set of periodic heterogeneous tasks with common period or periodic heterogeneous tasks with individual period. For task sets with common period, experimental results show that our task partitioning algorithms is able to reduce the peak temperature by as much as 5.8°C as compared to algorithms that only use task sequencing. For task sets with individual period, EDF scheduling with task partitioning can also lower the peak temperature, as compared to simple EDF scheduling, by as much as 6°C. Our analysis indicates that the numbers of additional context switches (overhead) is less than 2 per task, which is tolerable in many practical scenarios.
Keywords
electronics packaging; embedded systems; reliability; scheduling; EDF scheduling; Moore law; cooling cost; embedded systems; on-chip systems; packaging cost; real-time scheduling; reliability; temperature-aware task partitioning; Algorithm design and analysis; Benchmark testing; Cooling; Partitioning algorithms; Power demand; System-on-a-chip; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design (VLSID), 2012 25th International Conference on
Conference_Location
Hyderabad
ISSN
1063-9667
Print_ISBN
978-1-4673-0438-2
Type
conf
DOI
10.1109/VLSID.2012.64
Filename
6167746
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