• DocumentCode
    3531848
  • Title

    Smooth and anisotropic dry etching of InGaAlAs using Cl2/N2 ECR plasma

  • Author

    Uchiyama, H. ; Shinoda, K. ; Sato, H. ; Taike, A. ; Taniguchi, T. ; Tsuji, S.

  • Author_Institution
    Central Res. Lab., Hitachi Ltd., Tokyo, Japan
  • fYear
    2003
  • fDate
    12-16 May 2003
  • Firstpage
    468
  • Lastpage
    471
  • Abstract
    We developed a dry etching process for fabricating InGaAlAs laser mesa stripes and used it to fabricate an InGaAlAs-BH laser. We used optimized Cl2/N2 ECR plasma for the etching of an InGaAlAs laser multilayer structure. Use of this Cl2/N2 ECR plasma resulted in a uniform etching rate and resulted in an anisotropic etching by a nitrified side-protection mechanism. This smooth and anisotropic dry etching thus produced a well-matched interface between the etched surface and the semi-insulated Fe-InP regrown surface. The fabricated InGaAlAs-BH laser showed the stable operation at 85°C.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium arsenide; indium compounds; interface structure; semiconductor device measurement; semiconductor lasers; sputter etching; 85 degC; Cl2-N2; Cl2/N2 ECR plasma; Fe-InP; InGaAlAs laser mesa stripes; InGaAlAs-BH; InGaAlAs-BH laser; anisotropic dry etching; etching rate; Anisotropic magnetoresistance; Chemical lasers; Dry etching; Gallium arsenide; Indium phosphide; Nonhomogeneous media; Plasma applications; Quantum well lasers; Semiconductor lasers; Surface cleaning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 2003. International Conference on
  • Print_ISBN
    0-7803-7704-4
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2003.1205418
  • Filename
    1205418