• DocumentCode
    3533273
  • Title

    Minimizing winding losses in foil windings using field shaping techniques

  • Author

    Kutkut, Nasser H.

  • Author_Institution
    Soft Switching Technol. Corp., Middleton, WI, USA
  • Volume
    1
  • fYear
    1997
  • fDate
    22-27 Jun 1997
  • Firstpage
    634
  • Abstract
    High frequency foil windings offer a good solution to realize high power/high frequency magnetic components. The surface area available for cooling is quite large thus improving the thermal capacity of these windings and allowing higher current densities. However, at high frequencies, additional losses are incurred within foil windings due to the eddy currents induced by skin, proximity, fringing and other AC effects. In addition, the winding structure greatly affects the distribution of losses within the windings. This paper presents a technique to reduce high frequency AC losses in foil windings. By shaping and controlling the field distribution in a given foil design, the current distribution can be improved which results in an improvement in the winding losses
  • Keywords
    current distribution; high-frequency transformers; inductors; losses; magnetic variables control; skin effect; transformer windings; cooling; current distribution improvement; distribution losses; field distribution control; field distribution shaping; field shaping techniques; foil windings; fringing effect; high frequency AC losses reduction; high frequency magnetic components; high power magnetic components; higher current densities; impedance distribution; inductance distribution; inductors; proximity effect; skin effect; surface area; thermal capacity improvement; transformers; winding losses minimisation; Conductors; Current density; Differential equations; Equivalent circuits; Magnetic fields; Maxwell equations; Strips; Surface impedance; Surface resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Specialists Conference, 1997. PESC '97 Record., 28th Annual IEEE
  • Conference_Location
    St. Louis, MO
  • ISSN
    0275-9306
  • Print_ISBN
    0-7803-3840-5
  • Type

    conf

  • DOI
    10.1109/PESC.1997.616788
  • Filename
    616788