Title :
Research on the Characteristic Test of Via Holes in Microwave Circuits
Author :
Tian, Yu ; Liu, Yu ; Tong, Ling ; Liu, Jinxian
Author_Institution :
Coll. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
Abstract :
The detailed design and analysis for measuring characteristics of via holes in microwave circuits are presented, including the design of devices under test(DUT) and the test fixtures. Then the methodology of de-embedding based on TRL calibration is introduced which can help to extract the scattering parameters of via holes from the original measured data. The methodology including design, measurement and analysis will help the study of microstrip via holes.
Keywords :
design for testability; integrated circuit design; integrated circuit testing; microwave circuits; TRL calibration; characteristic test; devices under test; microwave circuits; via holes; Calibration; Circuit testing; Data mining; Design methodology; Fixtures; Microstrip; Microwave circuits; Microwave devices; Microwave measurements; Scattering parameters;
Conference_Titel :
Testing and Diagnosis, 2009. ICTD 2009. IEEE Circuits and Systems International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-2587-7
DOI :
10.1109/CAS-ICTD.2009.4960867
