Title :
Pulse plating for double sided printed circuit boards
Author :
Jayapoorani, S. ; Ghosh, Dalim Kumar
Author_Institution :
Dept. of Electron. & Commun. Eng., Sona Coll. of Technol., Salem, India
Abstract :
The present work describes the use of silver as a molecular adhesion layer between two layers of printed circuit board .This layer serves as a conductive media between two layers of the double sided Printed Circuit Board. Traditional copper has low conductivity and the usage of silver as a specialised metal facilitate to use the same PCB in the case of space craft applications.When pulse plating is used for plating in the plated through holes technique (PTH) nanostructured grain size is obtained. Silver serves as a metal against corrosion.
Keywords :
adhesion; corrosion; electrical conductivity; nanoelectronics; printed circuit design; printed circuits; silver; Ag; conductive media; double sided printed circuit boards; molecular adhesion layer; nanostructured grain size; plated through holes technique; pulse plating; space craft applications; Coatings; Silver; Printed Circuit board; double sided board; nano structured coating; pulse plating; silver; tarnish resistance;
Conference_Titel :
Nanoscience, Engineering and Technology (ICONSET), 2011 International Conference on
Conference_Location :
Chennai
Print_ISBN :
978-1-4673-0071-1
DOI :
10.1109/ICONSET.2011.6167890
