Title :
Application of electrospun nanofibers for the improvements in mode-i fracture toughness of fiberglass composites
Author :
Shendokar, Sachin ; Kelkar, Ajit ; Bolick, Ron
Author_Institution :
BVDU, Coll. of Eng., Pune, India
Abstract :
Delamination is a major mode of failure in laminated composites. This paper addresses development of advanced delamination resistant composites using interlaminar SiO2 nanoflbers. The SiO2 nanoflbers were manufactured using Tetra Ethyl Orthosilicate (TEOS) sol gel. The sol gel viscosity of 100-200 cps Voltage of 18kV and distance between spinneret and grounded collector plate of 80 mm were found to be suitable for maximizing production of electrospun fibers. It was observed that typical electrospun fibers were of 300 nm diameter after they were sintered at 600 degrees C. These SiO2 nanoflbers produced using electrospinning were then integrated into fiber glass Epon 862 resin matrix composites. During mechanical characterization of these three phase (fiber glass+Epon 862+SiO2 nanoflbers) composites, extensive experimentation was carried out as per the ASTM D 5528 standard to study the influence of electrospun SiO2 nanoflbers on the Mode I fracture toughness of fiber glass composites. Other characterization studies were related to determining the effect of SiO2 nanoflbers on short beam shear strength, flexure properties, and tensile properties of three phase composites.
Keywords :
bending; delamination; electrospinning; fracture toughness; glass fibre reinforced plastics; nanofibres; resins; shear strength; silicon compounds; sintering; sol-gel processing; tensile strength; viscosity; ASTM D 5528 standard; SiO2; delamination resistant composites; electrospinning; electrospun nanoflbers; fiber glass Epon 862 resin matrix composites; fiber glass+Epon 862+SiO<;sub>;2<;/sub>; nanoflbers; fiberglass composites; flexure properties; grounded collector plate; interlaminar nanoflbers; laminated composites; mechanical characterization; mode-I fracture toughness; shear strength; sintering; size 300 nm; size 80 nm; sol gel viscosity; spinneret; temperature 600 degC; tensile properties; tetraethyl orthosilicate sol gel; voltage 18 kV; Materials; Nanobioscience; Delamination; Electrospinning; Fracture Toughness; Nanofibers;
Conference_Titel :
Nanoscience, Engineering and Technology (ICONSET), 2011 International Conference on
Conference_Location :
Chennai
Print_ISBN :
978-1-4673-0071-1
DOI :
10.1109/ICONSET.2011.6167898