A novel CMOS-MEMS scanning micro-mirror using vertical comb drives

Author

Qu, Peng ; Qu, Hongwei

Author_Institution

Oakland Univ., Rochester, MI, USA

fYear

2012

fDate

6-9 Aug. 2012

Firstpage

63

Lastpage

64

Abstract

This paper presents design and simulation of an improved CMOS-MEMS electrostatic torsional micro-mirror for rotational scanning. The inclusion of substrate single crystal silicon (SCS) in vertical comb drives (VCDs) allows for large electrostatic force and scanning angle. The uniqueness of the VCDs also includes elevation tenability of the electrodes. The device design and simulation for improvements are based on AMI 0.5 μm CMOS technology with which the previous devices were fabricated. With typical technological parameters included in simulation, a maximum scanning angle of ±10° can be obtained at a 27 V driving voltage.

Keywords

CMOS integrated circuits; elemental semiconductors; micromechanical devices; micromirrors; silicon; AMI; CMOS-MEMS scanning micro-mirror; SCS; device design; electrodes; electrostatic force; electrostatic torsional micro-mirror; rotational scanning; scanning angle; substrate single crystal silicon; vertical comb drives; voltage 27 V; wavelength 0.5 mum; Electrostatics; Fingers; Mirrors; Silicon; Springs; Stators; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical MEMS and Nanophotonics (OMN), 2012 International Conference on

Conference_Location

Banff, AB

ISSN

2160-5033

Print_ISBN

978-1-4577-1511-2

Type

conf

DOI

10.1109/OMEMS.2012.6318803

Filename

6318803