Study on novel high performance polymer nanocomposites for electronics packaging paper

This study deals with preparation and characterization of novel nanocomposites based on poly(etheretherketone) (PEEK) as matrix and nano-silica (SiO₂) as filler. The content of SiO₂ was varied between 0 and 30 wt. % (20 vol. %). The density, morphology, mechanical and dielectric properties of PEEK/SiO₂ nanocomposites were investigated for use in electronic packaging. The density of the nanocomposites increased with the increasing content of SiO₂ in the PEEK. Scanning electron microscope showed uniform dispersion of nano-SiO₂ in the PEEK at lower SiO₂ content. However at higher SiO₂ content, severe aggregates were found. The 30 wt. % SiO₂ nanocomposite showed 54% increase in Vickers microhardness. A modified rule of mixtures with β = 0.10 fits the data nicely. The dielectric constant and the loss factor are within the range of requirements for commercial use.