Title :
Current induced magnetization switching in magnetic tunnel junction with MgO [001] tunnel barrier
Author :
Kubota, H. ; Fukushima, A. ; Ootani, Y. ; Yuasa, S. ; Ando, K. ; Maehara, Hiroaki ; Tsunekawa, K. ; Djayaprawira, D.D. ; Watanabe, N. ; Suzuki, Y.
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
Abstract :
Magnetic tunnel junction (MTJ) consisting of Ta/CuN/Ta/Pt50Mn50/Co70Fe30/Ru/Co60Fe20B20/MgO/Co60Fe20B20/Ta/Ru is prepared on a thermally oxidized silicon wafer by sputtering. Magnetoresistance is measured using AC four-point-probe method with applying magnetic field along the long axis of the elements. Current induced magnetization switching (CIMS) is measured by applying short current pulses. Results show that the MTJs showed large magnetoresistance of about 130% at room temperature and at a low bias voltage. A minor loop corresponding to the magnetization reversal of the free layer shows sharp switchings of the resistance. The resistance change due to CIMS is about 164 Ω (ΔR), which corresponds to 76% of the resistance change due to magnetic field sweep. A possible reason for this is the degradation of insulating property of the thin MgO barrier during the repetition of current bias sweep.
Keywords :
boron alloys; cobalt alloys; copper compounds; iron alloys; magnesium compounds; magnetic switching; magnetisation reversal; manganese alloys; platinum alloys; ruthenium; sputter deposition; tantalum; tunnelling magnetoresistance; 293 to 298 K; AC four-point-probe method; SiO; Ta-CuN-Ta-Pt50Mn50-Co70Fe30-Ru-Co60Fe20B20-MgO; bias voltage; current bias sweep; current induced magnetization switching; current pulses; free layer; insulating property degradation; magnetic field sweep; magnetic tunnel junction; magnetization reversal; magnetoresistance; room temperature; sputtering; thermally oxidized silicon wafer; thin barrier; tunnel barrier; Computer integrated manufacturing; Iron; Magnetic field measurement; Magnetic switching; Magnetic tunneling; Magnetization; Magnetoresistance; Pulse measurements; Silicon; Sputtering;
Conference_Titel :
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN :
0-7803-9009-1
DOI :
10.1109/INTMAG.2005.1463935