Ferromagnetic, transparent and conducting ITO-Fe-cluster composite films

Author

Peng, D.L. ; Sumiyama, K. ; Nozawa, N. ; Hihara, T.

Author_Institution

Dept. of Mater. Sci. & Eng., Nagoya Inst. of Technol., Japan

fYear

2005

fDate

4-8 April 2005

Firstpage

1051

Lastpage

1052

Abstract

Fe clusters are prepared by plasma-gas-condensation while the ITO films are generated by a helicon-sputtering system in a deposition chamber. The structure and morphology of the Fe-ITO-cluster composite films are measured by X-ray diffraction, transmission electron microscopy and scanning electron microscopy; its optical transmittance, electrical resistivity, and magnetic properties by spectrophotometer, conventional dc four-probe and SQUID magnetometer measurements, respectively. The results show that it is possible to produce a film material with high optical transmittance, low resistivity and ferromagnetism at room temperature by embedding Fe clusters into ITO matrix.

Keywords

X-ray diffraction; composite materials; electrical resistivity; ferromagnetic materials; indium compounds; iron; magnetic thin films; metal clusters; scanning electron microscopy; semiconductor thin films; semimagnetic semiconductors; spectrophotometry; sputter deposition; surface morphology; transmission electron microscopy; transparency; 300 K; Fe-InSnO; SQUID magnetometer; X-ray diffraction; conducting cluster composite films; conventional dc four-probe method; deposition chamber; electrical resistivity; ferromagnetic cluster composite films; ferromagnetism; hericon-sputtering system; morphology; optical transmittance; plasma-gas-condensation; room temperature; scanning electron microscopy; spectrophotometer; transmission electron microscopy; transparent cluster composite films; Conductive films; Electric variables measurement; Electrons; Indium tin oxide; Iron; Magnetic films; Magnetic force microscopy; Optical films; Optical microscopy; Plasma measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International

Print_ISBN

0-7803-9009-1

Type

conf

DOI

10.1109/INTMAG.2005.1463955

Filename

1463955