DocumentCode :
3535147
Title :
Dielectric properties of silica hollow spheres/epoxy nanocomposites
Author :
Hong Zhou ; Dang, Zhimin ; Zha, Junwei ; Yong Fan ; Chen, Hao
Author_Institution :
Key Lab. of Eng. Dielectr. & its Applic., Harbin Univ. of Sci. & Technol., Harbin, China
fYear :
2012
fDate :
24-28 July 2012
Firstpage :
1
Lastpage :
3
Abstract :
Silica nanostructure hollow spheres were synthesized using template method and the silica hollow spheres/epoxy nanocomposite was prepared by adding the silica hollow spheres modified by aminophenyl trimethoxysilane (APTMOS) into the epoxy resin. Dielectric properties were investigated in terms of frequency and filler concentration. The results showed that the introduction of the silica hollow spheres hardly influenced the thermal stability behavior. With the increase of the silica hollow spheres content, the dielectric permittivity tended to decrease firstly and then increase. While the dissipation factor value increased slightly with an increase in frequency, it still remained at a low level. We found that the silica hollow spheres/epoxy composite containing 3wt% silica hollow spheres content possessed a low dielectric permittivity, a high dielectric strength but a low dielectric loss.
Keywords :
dielectric losses; dielectric properties; nanocomposites; permittivity; resins; thermal stability; APTMOS; aminophenyl trimethoxysilane; dielectric permittivity; dielectric properties; epoxy resin; filler concentration; frequency concentration; high dielectric strength; low dielectric loss; silica hollow sphere-epoxy nanocomposite; template method; thermal stability behavior; Heating; Nanocomposites; dielectric properties; epoxy resin; fillers; silica hollow spheres;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
Conference_Location :
Bangalore
ISSN :
2160-9225
Print_ISBN :
978-1-4673-2852-4
Type :
conf
DOI :
10.1109/ICPADM.2012.6318910
Filename :
6318910
Link To Document :
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