• DocumentCode
    3535185
  • Title

    Fabrication and characterization of electrospun composite materials

  • Author

    Bian, Shanshan ; Jayaram, Shesha H. ; Cherney, Edward A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
  • fYear
    2012
  • fDate
    24-28 July 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this work, the characteristics of silicone rubber (SiR) and epoxy composites prepared by using the electrospinning technique are compared with conventionally prepared composite materials. Both micron sized silica fillers and silica/aluminum nanofillers are used in preparing the composites. The technique of electrospinning was used to enhance the dispersion of nanofillers by embedding the fillers in the polymer. The thermo-gravimetric analysis(TGA) of the composites has shown that the interfacial bonding between the fillers and the polymer matrix is strong in those samples prepared using the ES technique, which agrees with the uniform filler morphology observed in the SEM images. Further, it has been shown that heat resistance, tensile strength, and elongation at break for electrospun SiR samples are better than those for conventionally prepared samples. Similarly, for epoxy composites prepared using ES technique, a significant improvement in thermal properties have been obtained.
  • Keywords
    composite materials; dielectric materials; electrospinning; polymers; silicone rubber; thermal analysis; ES technique; SEM image; TGA; electrospin high insulating dielectric materials; electrospinning technique; electrospun SiR; electrospun composite material; epoxy composite; interfacial bonding; micron sized silica filler; polymer matrix; silica-aluminum nanofiller; silicone rubber; thermo-gravimetric analysis; uniform filler morphology; Cooling; Epoxy resins; Polymers; Silicon compounds; Thermal resistance; Electrospinning; TGA; composites; fillers; heat resistance; thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
  • Conference_Location
    Bangalore
  • ISSN
    2160-9225
  • Print_ISBN
    978-1-4673-2852-4
  • Type

    conf

  • DOI
    10.1109/ICPADM.2012.6318914
  • Filename
    6318914