Title :
MuCCRA-Cube: A 3D dynamically reconfigurable processor with inductive-coupling link
Author :
Saito, S. ; Kohama, Y. ; Sugimori, Y. ; Hasegawa, Y. ; Matsutani, H. ; Sano, T. ; Kasuga, K. ; Yoshida, Y. ; Niitsu, K. ; Miura, N. ; Kuroda, T. ; Amano, H.
Author_Institution :
Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
fDate :
Aug. 31 2009-Sept. 2 2009
Abstract :
MuCCRA-cube is a scalable three dimensional dynamically reconfigurable processor. By stacking multiple dies connected with inductive-coupling links, the number of PE array can be increased so that the required performance is achieved. A prototype chip with 90 nm CMOS process consisting of four dies each of which has a 4 times 4 PE array was implemented. The vertical link achieved 7.2Gb/s/chip, and the average execution time is reduced to 31% compared to that using a single chip.
Keywords :
CMOS integrated circuits; couplings; microprocessor chips; system-on-chip; 3D SoC; 3D dynamically reconfigurable processor; CMOS process; MuCCRA-cube; inductive-coupling link; reconfigurable architectures; size 90 nm; Bit error rate; CMOS process; CMOS technology; Costs; Fabrication; Large scale integration; Prototypes; Reconfigurable architectures; Reconfigurable logic; Stacking;
Conference_Titel :
Field Programmable Logic and Applications, 2009. FPL 2009. International Conference on
Conference_Location :
Prague
Print_ISBN :
978-1-4244-3892-1
Electronic_ISBN :
1946-1488
DOI :
10.1109/FPL.2009.5272565
