DocumentCode
3535529
Title
Study on curing process, surface strength and thermal diffusivity of epoxy nanocomposites
Author
Xu, F. ; Han, Z.D. ; Zhou, H.R.
Author_Institution
Sch. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China
fYear
2012
fDate
24-28 July 2012
Firstpage
1
Lastpage
4
Abstract
This paper aims at improving the surface strength properties and thermal conductivity of epoxy resin by adding two kinds of nano-particles, inorganic alumina nano-particles and organic nitrile rubber nano-powders. The curing process of epoxy based nanocomposites was investigated by differential scanning calorimeter (DSC). The surface strength properties and thermal diffusivity were evaluated by dynamic ultra-micro hardness tester and laser flash method, respectively. The results indicated that the curing reaction of nanocomposites was influenced by the addition of nano-particles. Alumina nano-particles exerts stronger influence on the curing reaction than nitrile rubber nano-powders by showing higher curing temperature. Compared with pure epoxy resin, the nanocomposites with mixed nano alumina and nitrile rubber have lower curing temperature. When using these two kinds of nano-particles together, the surface hardness and the elastic modulus were improved, meanwhile, the creep-resistant and deformation-resistant properties were enhanced. As a result, the surface strength property of epoxy composites was improved with addition of nano-powders. Meanwhile, the thermal diffusivity of nanocomposites was enhanced with the addition of alumina. The nanocomposites with rubber nano-powders and alumina nano-particles have the similar thermal diffusivity with those with 20 wt% alumina nano-particles.
Keywords
alumina; chemical reactions; creep; curing; differential scanning calorimetry; dynamic testing; elastic moduli; hardness testing; laser materials processing; microhardness; nanocomposites; nanoparticles; resins; rubber; thermal conductivity; thermal diffusivity; DSC; creep-resistant properties; curing process; deformation-resistant properties; differential scanning calorimeter; dynamic ultramicrohardness tester; elastic modulus; epoxy based nanocomposites; epoxy nanocomposites; epoxy resin; inorganic alumina nanoparticles; laser flash method; mixed nanoalumina; nanocomposite curing reaction; organic nitrile rubber nanopowders; surface strength property; thermal conductivity; thermal diffusivity; Curing; Heating; Nanocomposites; Plastics; Resins; Rubber; curing process; epoxy resin; nanocomposites; surface strength; thermal diffusivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
Conference_Location
Bangalore
ISSN
2160-9225
Print_ISBN
978-1-4673-2852-4
Type
conf
DOI
10.1109/ICPADM.2012.6318944
Filename
6318944
Link To Document