Title :
Preparation of bio-nanocomposites of chitosan/thermoplastic starch reinforced with multiwalled carbon nanotubes
Author :
Deepthi, M.V. ; Ananthapadmanabha, G.S. ; Sampathkumaran, P. ; Seetharamu, S. ; Pattenshett, V.V. ; Ganga, S. ; Thambi, V. Asai ; Sailaja, R.R.N.
Author_Institution :
Energy & Resources Inst. (TERI), Bangalore, India
Abstract :
High performance bio-nanocomposites have been developed using crosslinked chitosan and thermoplastic starch along with acid functionalized multiwalled carbon nanotubes (f-MWCNT). The f-MWCNT loading was varied from 0 to 10%. A small amount of Dibutyl maleate has been added as a coupling agent, in order to improve adhesion between the biomaterials. The nanocomposites developed were characterized for flexural, wear, electrical and thermal properties as per ASTM standards. The composites containing f-MWCNTs exhibited enhanced flexural properties when compared with composites without f-MWCNTs. The wear results showed that, with the addition of f-MWCNTs the slide wear loss reduced slightly. The results revealed that, the resistivity of the nanocomposites decreased indicating the increase in conductivity of the nanocomposites.
Keywords :
adhesion; bending; biomechanics; carbon nanotubes; electrical conductivity; electrical resistivity; nanobiotechnology; nanocomposites; nanofabrication; organic compounds; wear; ASTM standards; C; acid functionalized multiwalled carbon nanotube addition; acid functionalized multiwalled carbon nanotube loading; adhesion; biomaterials; bionanocomposite preparation; chitosan-thermoplastic starch; coupling agent; crosslinked chitosan; dibutyl maleate; electrical properties; flexural properties; high performance bionanocomposites; nanocomposite conductivity; nanocomposite resistivity; slide wear loss; thermal properties; wear properties; Abstracts; Carbon nanotubes; Mechanical factors; Mixers; Nanocomposites; Standards; Chitosan; Electrical; Flexural; MWCNT; Nanocomposites; Thermal properties; Thermoplastic starch; Wear;
Conference_Titel :
Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
Conference_Location :
Bangalore
Print_ISBN :
978-1-4673-2852-4
DOI :
10.1109/ICPADM.2012.6318945
