• DocumentCode
    3535845
  • Title

    Fabrication and dynamic testing of electrostatic actuators with p + silicon diaphragms

  • Author

    Yang, E.H. ; Yang, S.S. ; Han, S.W. ; Kim, S.Y.

  • Author_Institution
    Dept. of Control & Instrum. Eng., Ajou Univ., Suwon, South Korea
  • fYear
    1995
  • fDate
    6-10 Nov 1995
  • Firstpage
    28
  • Lastpage
    31
  • Abstract
    This paper presents the fabrication and testing of electrostatic actuators. The p+ diaphragm is used as a moving electrode, whereas the aluminum layer deposited on a #7740 pyrex glass is used as a fixed electrode. The dynamic characteristics of the actuator with the corrugated diaphragm and that with the flat one are tested and compared with the calculation results, respectively
  • Keywords
    diaphragms; electrostatic devices; elemental semiconductors; microactuators; silicon; #7740 pyrex glass; Si; aluminum layer; corrugated diaphragm; dynamic testing; electrostatic actuators; fabrication; flat diaphragm; p+ silicon diaphragm; Aluminum; Electrodes; Electrostatic actuators; Fabrication; Glass; Microactuators; Residual stresses; Silicon; Tensile stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and VLSI, 1995. TENCON '95., IEEE Region 10 International Conference on
  • Print_ISBN
    0-7803-2624-5
  • Type

    conf

  • DOI
    10.1109/TENCON.1995.496327
  • Filename
    496327
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3535845